Aluminum target for our sputter system. If you look closely you can see individual crystal grains.
Aluminum target for our sputter system. If you look closely you can see individual crystal grains. Sputtering is a technique used to deposit thin films of material. The material source is called a target because it is bombarded with high energy atoms which remove bits of material that are then redeposited on your sample or wafer. The ring is a result of the magnetic field confining the plasma to that region. -- source link
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